TSS-0035 is a fine spherical silica powder with a D50 of 2.5 to 4.0 µm. At this particle size, it disperses readily into resin systems without the steep viscosity rise that sub-micron particles produce. Its specific surface area of 1.5–2.5 m²/g gives the polymer matrix a good silica contact area, which helps manage thermal stress at the chip-package interface. The spherical particle shape gives resin compounds high packing density and good flowability during processing. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-0035 meets the electrical and mechanical demands of advanced semiconductor packaging.

Key applications

• Underfill compounds

• Die attach films and pastes

• Liquid encapsulants

• Electronic adhesives

• Semiconductor package substrate fillers

• Epoxy molding compounds (EMC)

Features

• Fine D50 (2.5–4.0 µm) for semiconductor packaging compounds and EMC fine-fraction fillers

• High SSA (1.5–2.5 m²/g) for strong polymer matrix bonding

• Spherical morphology for high filler loading and good flowability in resin systems

• High ionic purity for reliability-critical semiconductor packaging

TSS-0035