TSS-3080 is a coarse spherical silica powder with a D50 of 32.0 to 40.0 µm. At this particle size, the powder packs densely into laminate and cast-resin formulations, allowing high silica loading with less resin in the compound. An SSA of 0.45–1.5 m²/g keeps coupling-agent demand low and limits moisture absorption at the filler surface. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-3080 meets the electrical and mechanical demands of electronics manufacturing.

Key applications

• Copper clad laminates (CCL)

• Cast resin electrical insulation

• Industrial epoxy compounds

• Filled adhesives and sealants

• Surface coatings

Features

• Coarse D50 (32.0–40.0 µm) for CCL laminates, cast-resin systems, and industrial compounds

• Low SSA (0.45–1.5 m²/g) reduces coupling-agent demand and moisture absorption at the filler surface

• High bulk packing density for volume-efficient filler addition

• Custom particle size distribution (PSD) available on request

TSS-3080