TSS-030 is a medium-coarse spherical silica powder with a D50 of 26.0 to 34.0 µm. CCL prepregs use this particle size range for CTE reduction and long-term dimensional stability. An SSA of 0.65–1.65 m²/g keeps coupling-agent demand low and simplifies prepreg formulation. The spherical shape supports low dielectric loss in cured laminates, where signal integrity is part of the board specification. In multimodal EMC formulations, TSS-030 combines with finer silica grades to push total silica loading above 85 wt%. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-030 meets the electrical and mechanical demands of electronics manufacturing.

All our spherical silica powders are produced from recycled silica generated by Taiwan's EMC industry. Thrutek reprocesses this recycled silica to electronics-grade specification using our advanced powder processing techniques, including precise particle size classification, morphology optimization, and purity control. The result is a functional and high-performance spherical silica powder, but with a lower environmental footprint than mined or synthesized alternatives. Thrutek's silica grades are backed by the same reliable, high-quality supply and responsive technical support we offer for our AlN powders.

Key applications

• Copper clad laminates (CCL)

• Epoxy molding compounds (EMC)

• Potting and encapsulation compounds

• Electronic adhesives

Features

• D50 26.0–34.0 µm for CCL prepregs and high-loading EMC formulations

• Low dielectric loss for signal integrity in high-frequency PCB builds

• Low SSA (0.65–1.65 m²/g) reduces coupling-agent demand in prepreg formulations

• High ionic purity for reliability-critical electronics applications

• Custom particle size distribution (PSD) available on request

• Sustainably sourced from recycled silica

TSS-030