TSS-1545 is a spherical silica powder with a D50 of 14.0 to 22.0 µm. At this particle size, high filler ratios are achievable in transfer-molding compounds without compromising flow at injection temperatures. Spherical particles keep the compound flowing through transfer molds and reduce warpage in the finished package. In multimodal EMC blends, combining TSS-1545 with finer or coarser silica grades can push total silica loading toward 90 wt%. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-1545 meets the electrical and mechanical demands of semiconductor packaging.

Key applications

• Epoxy molding compounds (EMC)

• Copper clad laminates (CCL)

• Potting and encapsulation compounds

• Semiconductor package substrate fillers

• HDI substrate fillers

Features

• D50 14.0–22.0 µm for high-loading transfer-mold EMC and CCL formulations

• Spherical morphology reduces warpage in cured packages at high filler loading

• Low moisture content for reliable electrical performance in cured packages

• High ionic purity for reliability-critical semiconductor packaging

TSS-1545