TSS-1545 is a spherical silica powder with a D50 of 14.0 to 22.0 µm. At this particle size, high filler ratios are achievable in transfer-molding compounds without compromising flow at injection temperatures. Spherical particles keep the compound flowing through transfer molds and reduce warpage in the finished package. In multimodal EMC blends, combining TSS-1545 with finer or coarser silica grades can push total silica loading toward 90 wt%. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-1545 meets the electrical and mechanical demands of semiconductor packaging.

All our spherical silica powders are produced from recycled silica generated by Taiwan's EMC industry. Thrutek reprocesses this recycled silica to electronics-grade specification using our advanced powder processing techniques, including precise particle size classification, morphology optimization, and purity control. The result is a functional and high-performance spherical silica powder, but with a lower environmental footprint than mined or synthesized alternatives. Thrutek's silica grades are backed by the same reliable, high-quality supply and responsive technical support we offer for our AlN powders.

Key applications

• Epoxy molding compounds (EMC)

• Copper clad laminates (CCL)

• Potting and encapsulation compounds

• Semiconductor package substrate fillers

• HDI substrate fillers

Features

• D50 14.0–22.0 µm for high-loading transfer-mold EMC and CCL formulations

• Spherical morphology reduces warpage in cured packages at high filler loading

• Low moisture content for reliable electrical performance in cured packages

• High ionic purity for reliability-critical semiconductor packaging

• Sustainably sourced from recycled silica

TSS-1545