TSS-2040 is a spherical silica powder with a D50 of 20.0 to 26.0 µm. High filler ratios are achievable in transfer-molding compounds at this particle size without compromising flow at injection temperatures. Spherical particles keep the compound flowing through molds and reduce warpage in the finished package. In multimodal EMC blends, combining TSS-2040 with finer grades can push total silica loading toward 90 wt%. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-2040 meets the electrical and mechanical demands of semiconductor packaging.

Key applications

• Epoxy molding compounds (EMC)

• Copper clad laminates (CCL)

• Potting and encapsulation compounds

• Power electronics encapsulation

• HDI substrate fillers

Features

• D50 20.0–26.0 µm for high-loading EMC and CCL formulations

• Spherical morphology reduces warpage in cured packages at high filler loading

• Low moisture content for reliable electrical performance in cured packages

• High ionic purity for reliability-critical semiconductor packaging

• Custom particle size distribution (PSD) available on request

TSS-2040