TSS-005 is a spherical silica powder with a D50 of 4.0 to 8.0 µm. At this particle size, EMC and CCL formulations can carry high filler loading ratios without the viscosity penalties of finer grades. The spherical shape maintains compound flow through transfer molds and into fine package features. When blended with coarser silica grades, TSS-005 acts as the fine component, pushing total silica loading above 85 wt% in advanced EMC formulations. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-005 meets the electrical and mechanical demands of semiconductor packaging.

Key applications

• Epoxy molding compounds (EMC)

• Copper clad laminates (CCL)

• Potting and encapsulation compounds

• Capacitor encapsulants

• HDI substrate fillers

Features

• D50 4.0–8.0 µm for high-loading EMC and CCL formulations

• Spherical morphology reduces warpage in cured packages at high filler loading

• Low moisture content for reliable electrical performance in cured packages

• High ionic purity for reliability-critical semiconductor packaging

TSS-005