TSS-0035 is a fine spherical silica powder with a D50 of 2.5 to 4.0 µm. At this particle size, it disperses readily into resin systems without the steep viscosity rise that sub-micron particles produce. Its specific surface area of 1.5–2.5 m²/g gives the polymer matrix a good silica contact area, which helps manage thermal stress at the chip-package interface. The spherical particle shape gives resin compounds high packing density and good flowability during processing. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-0035 meets the electrical and mechanical demands of advanced semiconductor packaging.

All our spherical silica powders are produced from recycled silica generated by Taiwan's EMC industry. Thrutek reprocesses this recycled silica to electronics-grade specification using our advanced powder processing techniques, including precise particle size classification, morphology optimization, and purity control. The result is a functional and high-performance spherical silica powder, but with a lower environmental footprint than mined or synthesized alternatives. Thrutek's silica grades are backed by the same reliable, high-quality supply and responsive technical support we offer for our AlN powders.

Key applications

• Underfill compounds

• Die attach films and pastes

• Liquid encapsulants

• Electronic adhesives

• Semiconductor package substrate fillers

• Epoxy molding compounds (EMC)

Features

• Fine D50 (2.5–4.0 µm) for semiconductor packaging compounds and EMC fine-fraction fillers

• High SSA (1.5–2.5 m²/g) for strong polymer matrix bonding

• Spherical morphology for high filler loading and good flowability in resin systems

• High ionic purity for reliability-critical semiconductor packaging

• Sustainably sourced from recycled silica

TSS-0035