TSS-3080 is a coarse spherical silica powder with a D50 of 32.0 to 40.0 µm. At this particle size, the powder packs densely into laminate and cast-resin formulations, allowing high silica loading with less resin in the compound. An SSA of 0.45–1.5 m²/g keeps coupling-agent demand low and limits moisture absorption at the filler surface. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-3080 meets the electrical and mechanical demands of electronics manufacturing.

All our spherical silica powders are produced from recycled silica generated by Taiwan's EMC industry. Thrutek reprocesses this recycled silica to electronics-grade specification using our advanced powder processing techniques, including precise particle size classification, morphology optimization, and purity control. The result is a functional and high-performance spherical silica powder, but with a lower environmental footprint than mined or synthesized alternatives. Thrutek's silica grades are backed by the same reliable, high-quality supply and responsive technical support we offer for our AlN powders.

Key applications

• Copper clad laminates (CCL)

• Cast resin electrical insulation

• Industrial epoxy compounds

• Filled adhesives and sealants

• Surface coatings

Features

• Coarse D50 (32.0–40.0 µm) for CCL laminates, cast-resin systems, and industrial compounds

• Low SSA (0.45–1.5 m²/g) reduces coupling-agent demand and moisture absorption at the filler surface

• High bulk packing density for volume-efficient filler addition

• Custom particle size distribution (PSD) available on request

• Sustainably sourced from recycled silica

TSS-3080