TSS-040 is a very coarse spherical silica powder with a D50 of 38.0 to 46.0 µm. The high powder packing density at this particle size allows high silica loading while reducing the resin volume in the compound. An SSA of 0.2–0.5 m²/g gives the grade low compound viscosity and minimal coupling-agent demand. In CCL systems, this coarse particle size delivers volume-efficient CTE reduction; in industrial coatings, it controls surface texture and flow resistance in thick-film formulations. Combined with silica's low dielectric loss and low coefficient of thermal expansion, TSS-040 meets the electrical and mechanical demands of electronics manufacturing.

All our spherical silica powders are produced from recycled silica generated by Taiwan's EMC industry. Thrutek reprocesses this recycled silica to electronics-grade specification using our advanced powder processing techniques, including precise particle size classification, morphology optimization, and purity control. The result is a functional and high-performance spherical silica powder, but with a lower environmental footprint than mined or synthesized alternatives. Thrutek's silica grades are backed by the same reliable, high-quality supply and responsive technical support we offer for our AlN powders.

Key applications

• Copper clad laminates (CCL)

• Cast resin electrical insulation

• Industrial epoxy compounds

• Industrial coatings

• Artificial marble and engineered stone fillers

Features

• Coarsest D50 (38.0–46.0 µm) for CCL laminates, cast-resin systems, and industrial applications

• Very low SSA (0.2–0.5 m²/g) for minimal compound viscosity and coupling-agent demand

• High powder packing density for high-loading formulations with reduced resin content

• Custom particle size distribution (PSD) available on request

• Sustainably sourced from recycled silica

TSS-040